ADHESIVE SHEET, ADHESIVE SHEET WITH DIE SING SHEET, LAMINATE SHEET AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of reducing vibration of a semiconductor chip and reducing tip crack and connection defects between a wire and a pad.SOLUTION: There is provided an adhesive sheet having tensile storage elastic modulus at 130°C of 1 to 20 MPa and tanδ at 130°C or 0.1 to 0.3. There is provided an adhesive sheet having maximum value of tanδ of 0.5 to 1.4 and reaction calorie obtained by a DSC measurement under a condition with increasing temperature at 10°C/minute in a range of 25 to 300°C of 0 to 20 mJ/mg. There is provided an adhesive sheet consists of a resin component and a filler having BET specific surface area of 10/g or more and the resin component contains an acryl resin and the content of the inorganic filler of 45 to 90 wt.%.SELECTED DRAWING: Figure 1