| 摘要 |
PROBLEM TO BE SOLVED: To provide a component built-in substrate and a manufacturing method of the same, which can simplify a manufacturing process and achieve overall thinning, and which can prevent an increase in impedance and inductance between electrodes.SOLUTION: A component built-in substrate 1 having a multilayer structure comprises: double-side substrates 10a and 10b each having a first wiring layer 12, a first inter-layer conductive layer 13 and an opening 19 in which a first electronic component 91 or a second electronic component 90 is stored, which are formed on each surface of a first insulation layer 11; and an intermediate substrate 20 having a first adhesive layer 22 and a second inter-layer conductive layer 23 which are provided on each surface of a second insulation layer 21. The double-side substrates 10a and 10b are arranged in an upper layer and a lower layer of the intermediate substrate 20, respectively, and an electrode 91a of the first electronic component 91 located in the upper layer of the intermediate substrate 20 and an electrode 90a of the second electronic component 90 located in the lower layer of the intermediate substrate 20 are directly connected via the second inter-layer conductive layer 23.SELECTED DRAWING: Figure 1 |
