STEM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a stem for a semiconductor device capable of improving heat radiation characteristics.SOLUTION: A stem for a semiconductor device 10 comprises: an eyelet 20 that has a main body part 21 and a stationary part 22 provided on an upper surface 21A of the main body part 21; and a through-hole 21Z that penetrates through the main body part 21 in a thickness direction and that has a step part B1 on an inner wall surface. In addition, the stem 10 has a lead part 30 that has a cylindrical bush 32 whose outer peripheral surface is adhered onto the inner wall surface of the through-hole 21Z via an adhesive agent 50, and a lead pin 31 inserted into the bush 32 and fixed to the bush 32 by an encapsulation material 34. The bush 32 has a flange 33 protruded outward from a part of the outer peripheral surface of the bush 32 and locked with the step part B1. The main body part 21 and the stationary part 22 are formed of a material having a thermal conductivity higher than that of the bush 32. The bush 32 is formed of a material having a thermal expansion coefficient larger than that of the encapsulation material 34 and having a rigidity higher than that of the main body part 21.SELECTED DRAWING: Figure 1