| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling block which inhibits condensed water generated by dew condensation from flowing onto a circuit board even when a refrigerant cooling system is employed.SOLUTION: A cooling block 25 includes: a first surface 25a, which contacts with a heating electronic component 22, is disposed along a substantially vertical surface, and has a flat surface shape; a second surface 25b which extends from an upper end of the first surface 25a contacting with the heating electronic component 22 to the opposite side of the heating electronic component 22 in a direction intersecting with the first surface 25a and has a flat surface shape; a coolant pipe contact groove 25k which is disposed contacting with a refrigerant pipeline 10A, in which a refrigerant flows, and discharges heat conducted from the first surface 25a and the second surface 25b to the refrigerant pipeline 10A; and an inclined part which is located below the second surface 25b and inclines downward from the first surface 25a to the side opposite to and away from the heating electronic component 22.SELECTED DRAWING: Figure 4 |
