| 摘要 |
The present disclosure relates to a taped semiconductor device, a method and an apparatus for producing the taped semiconductor device. The method comprises preparing a lead frame and a tape layer in a chamber, and subsequently enclosing the chamber. The method further comprises creating a substantial vacuum inside the chamber. The method yet further comprises attaching the tape layer to the lead frame to form the taped semiconductor device. The taped semiconductor device is formed while being in the substantial vacuum. An advantage of using this method for producing the taped semiconductor device is that the risks of air bubbles or spaces forming in the taped semiconductor are substantially mitigated because the attachment of the tape layer to the lead frame is performed in a substantial vacuum. |
