发明名称 ELECTRICAL INTERCONNECT FOR ELECTRONIC PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide, for example, an electrical interconnect for an electronic package.SOLUTION: The electrical interconnect includes a dielectric layer with a trench formed in one surface thereof, and a signal conductor that fills the trench and extends above the one surface of the dielectric layer. The electrical interconnect further includes a conductive reference layer mounted on an opposing side of the dielectric layer. The conductive reference layer is electromagnetically coupled to the signal conductor when current passes through the signal conductor.SELECTED DRAWING: Figure 1
申请公布号 JP2016100600(A) 申请公布日期 2016.05.30
申请号 JP20150208684 申请日期 2015.10.23
申请人 INTEL CORP 发明人 YONG KHANG CHOONG;BOK ENG CHEAH;BEH TEONG KEAT;HOWARD L HECK;JACKSON CHUNG PENG KONG;STEPHEN H HALL;KOOI CHI OOI
分类号 H01L23/12;H05K1/02;H05K1/11;H05K3/10;H05K3/18;H05K3/40 主分类号 H01L23/12
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