| 摘要 |
PROBLEM TO BE SOLVED: To cool heat generated by heating components in a more efficient manner.SOLUTION: A cooling device 100 in a first embodiment of the invention includes a first heat radiation part 110 and a heat conductive part 130. The first heat radiation part 110 is thermally coupled to a first heating component 220 mounted on a first surface (a front surface) of a substrate 210. The heat conductive part 130 has flexibility. The heat conductive part 130 is thermally coupled to a second heating component 230 mounted on a second surface (a rear surface) of the substrate 210 and the first heat radiation part 110.SELECTED DRAWING: Figure 1 |
