发明名称 HIGH-FREQUENCY COIL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency coil device that can suppress great increase of a conductor loss even when the wire width of a conductor pattern is reduced, and also suppress reduction of self-inductance and mutual-inductance caused by increasing the thickness of the overall conductor pattern.SOLUTION: A high-frequency coil device has a laminate 10 having plural laminated base material layers, a conductor pattern disposed along the base material layer, and an interlayer connection conductor that is formed on the base material layer and conducted to the conductor pattern. The conductor pattern contains linear conductor patterns 21 to 24, and a coil having a winding axis in the lamination direction of the plural base material layers is constructed by the linear conductor patterns and the interlayer connection conductors. The linear conductor patterns 21 to 24 are formed by conductive paste patterns printed on the base material layers. The thickness of the inner portion 20M of a coil opening of the coil based on the conductive paste pattern is larger than the thickness of an outer portion 20E of the coil opening of the coil based on the conductive paste pattern.SELECTED DRAWING: Figure 4
申请公布号 JP2016100344(A) 申请公布日期 2016.05.30
申请号 JP20140233279 申请日期 2014.11.18
申请人 MURATA MFG CO LTD 发明人 OCHIAI SEI;ISHITSUKA KENICHI;NISHIDA HIROSHI
分类号 H01F17/00 主分类号 H01F17/00
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