PEELABLE METAL FOIL AND MANUFACTURING METHOD OF THE SAME, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent a peelable metal foil from being peeled due to stress in a manufacturing process of a printed circuit board to improve manufacturing yield of the printed circuit board.SOLUTION: A manufacturing method of a printed circuit board comprises the steps of: manufacturing a multilayer substrate by layering an insulating resin layers and a peelable metal foil in which a plurality of through holes are formed on an outer periphery of the peelable metal foil and a plurality of metal layers are layered with peelable intermediate layers being sandwiched among the metal layers one by one for making the plurality of metal layers be peelable by the intermediate layers and a plurality of through holes are formed adjacent to each other on an outer periphery of the peelable metal foil; cutting off a peripheral part of the multilayer substrate by machine work; and subsequently peeing the peelable metal foils to manufacture the printed circuit board.SELECTED DRAWING: Figure 1