发明名称 HEAT-CURABLE CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a heat-curable conductive paste for forming a conductive film excellent in electrical conductivity.SOLUTION: The present invention provides the heat-curable conductive paste which contains a conductive powder, a thermosetting epoxy resin, a curing agent, and a catalyst. The conductive powder is obtained by surface-treating a metal powder as a core with a carboxylic acid or its salt. The curing agent is a compound capable of reacting with the epoxy resin by heating to generate a hydroxyl group. The catalyst is a catalyst allowing an esterification reaction between the carboxylic acid or its salt and the hydroxyl group to proceed.SELECTED DRAWING: Figure 2
申请公布号 JP2016100134(A) 申请公布日期 2016.05.30
申请号 JP20140235003 申请日期 2014.11.19
申请人 NORITAKE CO LTD 发明人 BABA TATSUYA;FUKAYA SHUHEI;KAKIZOE HIROTO
分类号 H01B1/22;C08G59/40;C08L63/00;C09D5/24;C09D7/12;C09D163/00;H01B1/00;H01B5/14 主分类号 H01B1/22
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