发明名称 |
THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE |
摘要 |
The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦̸Ea≦̸120 [kJ/mol]  (1); and 10,000≦̸α×E′≦̸300,000 [Pa/K]  (2). |
申请公布号 |
SG11201602233P(A) |
申请公布日期 |
2016.05.30 |
申请号 |
SG11201602233P |
申请日期 |
2014.09.09 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MORITA,KOSUKE;ISHIZAKA,TSUYOSHI;TOYODA,EIJI;SHIGA,GOJI;IINO,CHIE;ISHII,JUN |
分类号 |
C08J5/18;H01L21/56;H01L21/60;H01L23/12;H01L23/29;H01L23/31 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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