发明名称 |
BUFFING APPARATUS AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate. |
申请公布号 |
SG10201508329U(A) |
申请公布日期 |
2016.05.30 |
申请号 |
SG10201508329U |
申请日期 |
2015.10.07 |
申请人 |
EBARA CORPORATION |
发明人 |
YAMAGUCHI, KUNIAKI;KOBATA, ITSUKI;MIZUNO, TOSHIO |
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