| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits peeling between a sealer and a resin portion of a plastic housing to achieve long-term reliability.SOLUTION: A semiconductor device 1 includes: an insulation substrate 2; a semiconductor element 6 fixed to a circuit board 5 of the insulation substrate 2; a wiring member 8; and a hollow shaped plastic housing 10 which houses the insulation substrate 2, the semiconductor element 6, and the wiring member 8; and a sealer 13. The plastic housing 10 has an inner frame 10a on its inner surface and a step 10b is formed at a tip of the inner frame 10a.SELECTED DRAWING: Figure 1 |
