| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure capable of preventing a phenomenon that a substrate is bent in an upward convex state, in a base plate-less structure that uses no base plate for fixing a substrate.SOLUTION: An insert vertical electrode region E21 and a part of a horizontal electrode region for case contact E22 of an electrode insert part E2 of an external electrode 21 are insert-molded in an in-case insert region 3a that forms a housing case 3. That is, the horizontal electrode region for case contact E22 is inserted into the in-case insert region 3a as a part of the electrode insert part E2, and thereby, both an upper surface and a lower surface of the horizontal electrode region for case contact E22 are contacted with the in-case insert region 3a.SELECTED DRAWING: Figure 3 |
