PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board requiring a circuit pattern of a fine pitch for connection between a plurality of electronic components mounted; a method of manufacturing the same; and an electronic component module.SOLUTION: A first insulating layer 20 is formed to cover a first circuit layer having a circuit pattern of a normal pitch; a second circuit layer 25 having a circuit pattern of a fine pitch is formed on the first insulating layer 20; further a second insulating layer 120 is formed; and a third circuit layer 125 having a circuit pattern of a normal pitch is formed on the second insulating layer; thereby obtaining a printed circuit board 100A having a circuit pattern of a fine pitch required for connection between the plurality of electronic components.SELECTED DRAWING: Figure 1