| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation efficiency.SOLUTION: An electronic apparatus includes: a housing; a substrate, disposed inside the housing, mounted with an exothermic body; and a facing member, disposed inside the housing, having facing surfaces facing to a surface on which the exothermic body of the substrate is mounted. The electronic apparatus includes a radiator plate formed by alternately laminating at the facing surface of the facing member an adhesive layer having an opening at a position corresponding to the exothermic body and a thermal diffusion sheet. The electronic apparatus includes a pressing member for polymerizing a plurality of thermal diffusion sheets at a position of the opening by pressing the exothermic body to a region corresponding to an opening of the adhesive layer among the radiation plate.SELECTED DRAWING: Figure 4 |
