SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a solid-state imaging device capable of suppressing peeling of a fixed charge film while suppressing a dark current.SOLUTION: The solid-state imaging device includes: a semiconductor substrate 121 in which a plurality of photodiodes 122 are formed; a groove 121A formed in the depth direction from a light incident side in order to form an element isolation part 127 between adjacent photoelectric conversion elements in the semiconductor substrate 121; a first fixed charge film 123A formed so as to cover a surface of a plane part on the light incident side of the semiconductor substrate 121; and a second fixed charge film 123B formed so as to cover an inner wall surface of the groove 121A formed in the semiconductor substrate 121.SELECTED DRAWING: Figure 2