发明名称 RESIN MOLD APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin mold apparatus capable of achieving installation by reducing an installation area as much as possible for adaptation to large item small volume production of works as well as resin mold without degrading molding quality.SOLUTION: A lengthwise film F is wound down from a wind-down roll 20a provided on one side in the mold opening/closing direction of a mold tool 17, and is guided along at least one metal tool clamp face by a pair of guide rollers 20e, 20f and transferred to be wound up around a wind-up roll 20b provided on the other side in the mold opening/closing direction of the mold tool 17.SELECTED DRAWING: Figure 2
申请公布号 JP2016100375(A) 申请公布日期 2016.05.30
申请号 JP20140234078 申请日期 2014.11.19
申请人 APIC YAMADA CORP 发明人 OGUCHI TATSUJI;KITAJIMA NOBUHIRO;KIDA KENJI;KOBAYASHI KAZUHIKO
分类号 H01L21/56;B29C33/68 主分类号 H01L21/56
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