| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate in which, even when distortion occurs due to application of a voltage on an electronic component embedded in a resin layer, vibration thereof is reduced and further occurrence of audible sound caused by the vibration is prevented or suppressed, and to provide a method of manufacturing the electronic component built-in substrate.SOLUTION: An electronic component built-in substrate 1 includes: a core substrate B: an electronic component 10 mounted on one principal surface of the core substrate B with a joint member S; and a resin layer R provided with the electronic component 10 embedded therein. The electronic component 10 includes: a ceramic laminate body 11; and a first external electrode 12 having an end surface portion TP12 and a second external electrode 13 having an end surface portion TP13, which each are mounted on an end surface of the ceramic laminate body 11. A surface of the resin layer R in contact with the end surface portion TP12 of the first external electrode 12 and the joint member S includes a first non-adhesive surface UA1, and a surface of the resin layer R in contact with the end surface portion TP13 of the second external electrode 13 and the joint member S includes a second non-adhesive surface UA2.SELECTED DRAWING: Figure 2 |
