发明名称 COMPONENT TRANSFER MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a component transfer member capable of transferring a component under an adhering state to a surface and facilitating peeling-off of even a flaky component, such as a chip resistor, after transferring.SOLUTION: A component transfer member 1 includes a body part 10 having a first face 10a and a second face 10b opposing to each other. In the body part 10, a plurality of through holes 18 penetrating from the first face 10a to the second face 10b are formed. Around the respective through holes 18 on both of the first face 10a side and the second face 10b side of the body part 10, there are formed a first adhesive part 22 and a second adhesive part 26 which are formed from adhesive rubber and makes a component adhere to a surface. Any part other than the first adhesive part 22 and the second adhesive part 26 on the first face 10a side and the second face 10b side of the body part 10 is non-adhesive parts 24, 28 which do not make any component adhesive.SELECTED DRAWING: Figure 3
申请公布号 JP2016100558(A) 申请公布日期 2016.05.30
申请号 JP20140238632 申请日期 2014.11.26
申请人 SHIN ETSU POLYMER CO LTD 发明人 HAYASHI KIYOSHI;HOIZUMI SATOSHI
分类号 H01G13/00;B65D85/86 主分类号 H01G13/00
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