| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer which enables the suppression of sudden rise in cost.SOLUTION: A semiconductor wafer W comprises, on a surface WS, an integrated circuit D including a semiconductor device DS and TEG 1. TEG 1 includes: an evaluation circuit 2 including an evaluation device 2a used for a withstand voltage test of the integrated circuit D; an electrode part 3 for bringing a probe needle for applying a voltage to the evaluation circuit 2 into contact therewith; and wiring 4 for electrically connecting between the evaluation circuit 2 and the electrode part 3. The wiring 4 has a fuse part 4a locally formed between the evaluation circuit 2 and the electrode part 3 to have a smaller line width. The fuse part 4a is larger, in line width, than a circuit included in the evaluation circuit 2; when the withstand voltage test brings the evaluation circuit 2 to an overcurrent state, the wiring 4 is caused to generate heat and thus, fused and cut. The fuse part 4a suppresses the spreading of heat generation to the electrode part 3 which the probe needle is put in contact with, and it prevents the electrode part 3 with the probe needle put thereon from being fused, and a protection film 3a of the electrode part 3 from being broken.SELECTED DRAWING: Figure 2 |
