发明名称 |
OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which can properly protect a semiconductor optical element by a resin part.SOLUTION: A semiconductor device comprises: a substrate 2; a first electrode 3 which is provided on an external surface of the substrate 2 and has a die bonding pad 3a; a light emitting element 6 which has an outer shape smaller than the die bonding pad 3a and which is provided on the die bonding pad 3a; an annular stepped part 9 provided on the die bonding pad 3a so as to surround the light emitting element 6; and a resin part 7 provided to surround an outside of the stepped part 9.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016100385(A) |
申请公布日期 |
2016.05.30 |
申请号 |
JP20140234306 |
申请日期 |
2014.11.19 |
申请人 |
PIONEER ELECTRONIC CORP;PIONEER MICRO TECHNOLOGY CORP |
发明人 |
HASEGAWA KATSUHISA |
分类号 |
H01L33/60;H01L23/02;H01L23/08;H01L31/02;H01L33/62 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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