发明名称 OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an optical semiconductor device which can properly protect a semiconductor optical element by a resin part.SOLUTION: A semiconductor device comprises: a substrate 2; a first electrode 3 which is provided on an external surface of the substrate 2 and has a die bonding pad 3a; a light emitting element 6 which has an outer shape smaller than the die bonding pad 3a and which is provided on the die bonding pad 3a; an annular stepped part 9 provided on the die bonding pad 3a so as to surround the light emitting element 6; and a resin part 7 provided to surround an outside of the stepped part 9.SELECTED DRAWING: Figure 1
申请公布号 JP2016100385(A) 申请公布日期 2016.05.30
申请号 JP20140234306 申请日期 2014.11.19
申请人 PIONEER ELECTRONIC CORP;PIONEER MICRO TECHNOLOGY CORP 发明人 HASEGAWA KATSUHISA
分类号 H01L33/60;H01L23/02;H01L23/08;H01L31/02;H01L33/62 主分类号 H01L33/60
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