| 摘要 |
Disclosed are a semiconductor package including an overhang part, and a manufacturing method thereof. The method includes the steps of: forming a structure on one surface of a substrate on which multiple bonding fingers and dummy bonding fingers are formed; forming an overhang part by laminating a semiconductor chip, on which multiple bonding pads and dummy bonding pads are formed, on the structure so that a side edge protrudes more than a lateral side of the structure; forming multiple dummy wires connecting the dummy bonding pads with the dummy bonding fingers; and forming multiple conductive wires electrically connecting the bonding fingers with the bonding pads after the formation of the dummy wires. Therefore, the present invention is capable of improving a yield of the product by suppressing a bonding fault of a conductive wire. |
