| 摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to amorphous Poly-Alpha-composition adhesive with low temperature of application and can be used for manufacturing of absorbent disposable products. Hot-melt adhesive contains 45 wt% based on weight of adhesive, amorphous polybutene copolymer containing propylene comonomer, having softening temperature of 70-105°C, viscosity of less than approximately 1,900 sP at 190 °C and tan δ more than 30 at 140 °C. Hot-melt adhesive has viscosity of less than approximately 6,000 sP at 150 °C.EFFECT: invention makes it possible to apply hot-melt adhesive at low temperature is lower than 150 °C while maintaining mechanical strength and appearance of glue.8 cl, 3 tbl |
