| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel transfer process.SOLUTION: The present invention relates to a process for transferring an active layer (2) to a final substrate (4) using a temporary substrate (5), the active layer including a first side (1) having an inherent surface topology. The process includes: a first step of bonding the first side (1) of the active layer (2) to one side of the temporary substrate (5); a second step of bonding a second side (6) of the active layer (2) to the final substrate (4); and a third step of separating the active layer (2) and the temporary substrate (5). In the process, the side of the temporary substrate (5) possesses a surface topology complementary to the surface topology of the first side (1) of the active layer (2), so that the surface topology of the temporary substrate (5) encapsulates the surface topology of the first side (1) of the active layer (2) in the first step of bonding.SELECTED DRAWING: Figure 3 |
