ARRAY SUBSTRATE, RADIATION DETECTOR, AND WIRING SUBSTRATE

摘要

According to the embodiment, an array substrate includes a substrate, a plurality of first wirings, a plurality of second wirings, a thin film transistor, a protective layer, and a plurality of connection parts electrically connected to each of the plurality of first wirings and the plurality of second wirings, and including a conductive material having higher corrosion resistance than a material of the plurality of first wirings and the plurality of second wirings.;An end surface of the plurality of first wirings and the plurality of second wirings on peripheral side of the substrate is covered with the protective layer, and an end surface of the connection part on the peripheral side of the substrate is located at a periphery of the substrate in plan view.

主权项

1. An array substrate comprising:
a substrate; a plurality of first wirings provided on a surface of the substrate and extending in a first direction; a plurality of second wirings provided on the surface of the substrate and extending in a second direction crossing the first direction; a thin film transistor provided in each of a plurality of regions defined by the plurality of first wirings and the plurality of second wirings; a protective layer covering at least the plurality of first wirings and the plurality of second wirings; and a plurality of connection parts provided in at least one of a region on the protective layer, a region between the plurality of first wirings and the substrate, and a region between the plurality of second wirings and the substrate, electrically connected to each of the plurality of first wirings and the plurality of second wirings, and including a conductive material having higher corrosion resistance than a material of the plurality of first wirings and the plurality of second wirings, an end surface of the plurality of first wirings and the plurality of second wirings on peripheral side of the substrate being covered with the protective layer, and an end surface of the connection part on the peripheral side of the substrate being located at a periphery of the substrate in plan view.