| 摘要 |
An LED glue dispensing fixture, comprising: a rigid plate (1), several through holes (2) for curing a glue dispensed on the rigid plate, the size of the through holes matches the size of glue dispensing areas of an LED chip (3). The rigid plate is disposed on an auxiliary fixture to close one side of the through holes, thereby allowing the glue to be injected and accommodated within the through holes via the other side of the through holes, the glue is temporarily cured within the through holes via drying, the rigid plate is taken out from the auxiliary fixture, the rigid plate and an LED chip carrier (4) are assembled such that the through holes and the LED chip are opposite to each other, the glue within the through holes is then melted to adhere to the LED chip, the auxiliary fixture is taken out, and then the LED chip is dried and formed. Therefore, the glue dispensing of the LED chip on the entire carrier can be finished through one-pass process, thus improving production efficiency. |
