MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

摘要

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.

主权项

1. A printed circuit board comprising:
a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising:
first and second signal vias forming a differential signal pair, the first and second signal vias each being configured with a first section having a first diameter and a second section having a second diameter, less than the first diameter; andground shadow vias adjacent to each of the first and second signal vias, the ground shadow vias each comprising a first section having a third diameter and a second section having a fourth diameter.