Method for Producing a Material-Bonding Connection between a Semiconductor Chip and a Metal Layer

摘要

A method for producing a material-bonding connection between a semiconductor chip and a metal layer is disclosed. For this purpose, a semiconductor chip, a metal layer, which has a chip mounting portion, and also a bonding medium containing a metal powder are provided. The metal powder is sintered in a sintering process. In this case, throughout a prescribed sintering time, the prescribed requirements are met, that the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer, that the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure, that the bonding medium is kept in a temperature range that lies above a minimum temperature and that a sound signal is introduced into the bonding medium.

主权项

1. A method for producing a material-bonding connection between a semiconductor chip and a metal layer, comprising:
providing a semiconductor chip; providing a metal layer, which has a chip mounting portion; providing a bonding medium containing a metal powder; sintering the metal powder in a sintering process, in which throughout a prescribed sintering time the prescribed requirements are met,
the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer;the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure;the bonding medium is kept in a temperature range that lies above a minimum temperature; anda sound signal is introduced into the bonding medium.