发明名称 Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
摘要 A method of manufacturing a semiconductor device includes (a) providing a substrate and (b) forming a film including a first element, a second element and a third element in a same group as the second element on the substrate by performing a cycle a predetermined number of times, the cycle including: (b-1) supplying a halogen-based source gas including the first element to the substrate; (b-2) supplying a first reactive gas including the second element and reactive with the halogen-based source gas; and (b-3) supplying a second reactive gas including the third element without mixing the second reactive gas with the first reactive gas, wherein the second reactive gas is reactive with the halogen-based source gas and unreactive with the first reactive gas.
申请公布号 US2016148811(A1) 申请公布日期 2016.05.26
申请号 US201514947523 申请日期 2015.11.20
申请人 Hitachi Kokusai Electric Inc. 发明人 NAKATANI Kimihiko;HARADA Kazuhiro;KITAMURA Masahito
分类号 H01L21/285;H01L21/28 主分类号 H01L21/285
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, comprising: (a) providing a substrate; and (b) forming a film comprising a first element, a second element and a third element in a same group as the second element on the substrate by performing a cycle a predetermined number of times, the cycle comprising: (b-1) supplying a halogen-based source gas including the first element to the substrate; (b-2) supplying a first reactive gas including the second element and reactive with the halogen-based source gas; and (b-3) supplying a second reactive gas including the third element without mixing the second reactive gas with the first reactive gas, wherein the second reactive gas is reactive with the halogen-based source gas and unreactive with the first reactive gas.
地址 Tokyo JP