发明名称 |
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus |
摘要 |
A method of manufacturing a semiconductor device includes (a) providing a substrate and (b) forming a film including a first element, a second element and a third element in a same group as the second element on the substrate by performing a cycle a predetermined number of times, the cycle including: (b-1) supplying a halogen-based source gas including the first element to the substrate; (b-2) supplying a first reactive gas including the second element and reactive with the halogen-based source gas; and (b-3) supplying a second reactive gas including the third element without mixing the second reactive gas with the first reactive gas, wherein the second reactive gas is reactive with the halogen-based source gas and unreactive with the first reactive gas. |
申请公布号 |
US2016148811(A1) |
申请公布日期 |
2016.05.26 |
申请号 |
US201514947523 |
申请日期 |
2015.11.20 |
申请人 |
Hitachi Kokusai Electric Inc. |
发明人 |
NAKATANI Kimihiko;HARADA Kazuhiro;KITAMURA Masahito |
分类号 |
H01L21/285;H01L21/28 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a semiconductor device, comprising:
(a) providing a substrate; and (b) forming a film comprising a first element, a second element and a third element in a same group as the second element on the substrate by performing a cycle a predetermined number of times, the cycle comprising: (b-1) supplying a halogen-based source gas including the first element to the substrate; (b-2) supplying a first reactive gas including the second element and reactive with the halogen-based source gas; and (b-3) supplying a second reactive gas including the third element without mixing the second reactive gas with the first reactive gas, wherein the second reactive gas is reactive with the halogen-based source gas and unreactive with the first reactive gas. |
地址 |
Tokyo JP |