| 摘要 |
The present invention relates to a substrate processing apparatus. More specifically, the substrate processing apparatus can minimize air exposure of a substrate which is completed with predetermined treatment in a process chamber, simplifies facility, and lowers manufacturing costs. According to the present invention, the substrate processing apparatus includes: an in-outlet module which draws a substrate in or out in an upright position; a first movement means which moves the substrate in the in-outlet module; a load lock chamber which is arranged near the in-outlet module to exchange the substrate; a transfer chamber which is arranged near the load lock chamber; a second moving means which moves the substrate in the transfer chamber; and a process chamber which is arranged near the transfer chamber to execute the predetermined treatment with the substrate. |
