发明名称 ELECTRONIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide an electronic module, having a surface mounting region for a power amplifier, and realizing low power consumption of the power amplifier.SOLUTION: An electronic module comprises: a wiring board that has a surface with a terminal including a power source supplying terminal, and an opposite surface to which a rand for surface-mounding a component including a power amplifier; a first IC that is arranged inside of a board thickness part, detects an RF signal, and outputs an envelope detection signal; a second IC that is arranged inside of the board thickness part, converts a power source voltage supplied to the power source supplying terminal based on the envelope detection signal, and outputs the voltage tracking to the envelope detection signal; a conducting path that leads the voltage so as to supply the power source to the power amplifier and is arranged to the wiring board; and a delay element that allows the RF signal to delay so as to correspond to delay until reaching the envelope detection signal from the RF signal and the delay until reaching an output voltage of the second IC from the envelope detection signal, leads to the power amplifier as an input signal, and is arranged to the wiring board.SELECTED DRAWING: Figure 1
申请公布号 JP2016096520(A) 申请公布日期 2016.05.26
申请号 JP20140233024 申请日期 2014.11.17
申请人 DAINIPPON PRINTING CO LTD 发明人 SAWADA KEISUKE
分类号 H03F1/02;H01L23/12;H03F3/24 主分类号 H03F1/02
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