PRINTED CIRCUIT BOARD WITH ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD FOR MANUFACTURING THE SAME

摘要

Disclosed are an electronic component-embedded printed circuit board and a method of manufacturing the same. An electronic component-embedded printed circuit board includes a laminated structure comprising resin insulation layers and conductive layers laminated alternately, a via formed in the resin insulation layers and electrically connecting the conductive layers to one another, a plurality of connection terminals formed on one surface of the laminated structure, a cavity formed on the other surface of the laminated structure, and an electronic component inserted in the cavity, and a depressed portion in which a surface of the electronic component exposed through an opening of the cavity is depressed in comparison to the other surface of the laminated structure.

主权项

1. An electronic component-embedded printed circuit board comprising:
a laminated structure comprising resin insulation layers and conductive layers laminated alternately; a via formed in the resin insulation layers and electrically connecting the conductive layers to one another; a plurality of connection terminals formed on one surface of the laminated structure; a cavity formed on the other surface of the laminated structure, and an electronic component inserted in the cavity; and a depressed portion in which a surface of the electronic component exposed through an opening of the cavity is depressed in comparison to the other surface of the laminated structure.