ELECTRONIC DEVICE HAVING HEAT CONDUCTING MEMBER

摘要

An electronic device includes a semiconductor module, a wiring substrate, a case member and a heat conducting member. The heat conducting member thermally connects predetermined portions of wiring patterns and a heat conducting pattern of the wiring substrate to a predetermined heat conduction region of a surface of the case member opposing to the wiring substrate. The predetermined heat conduction region is located further from the wiring substrate than a surface of a body portion opposing to the case member. The heat conducting pattern is disposed adjacent to at least one of non-terminal projecting surfaces of the body portion on a surface of the wiring substrate. The heat conducting pattern has a surface that is not covered with solder resist at least at a part. As a result, an area of a heat conducting passage increases and heat radiation performance can be increased.

主权项

1. An electronic device comprising:
a semiconductor module having a body portion with a rectangular parallelepiped shape and a plurality of terminal portions projecting from two of four side surfaces of the body portion, the two of the four side surfaces of the body portion being referred to as terminal projecting surfaces, the other two of the four side surfaces of the body portion being referred to as terminal non-projecting surfaces; a wiring substrate having a wiring pattern and a heat conducting pattern, the wiring pattern having a plurality of connecting portions each electrically connected to a corresponding one of the terminal portions and a surface that is covered with a solder resist at least at a part, and the heat conducting pattern having a surface that is not covered with the solder resist at least at a part and being disposed adjacent to at least one of the terminal non-projecting surfaces of the body portion on a surface of the wiring substrate; a case member opposed to the wiring substrate and spaced from the wiring substrate; and a heat conducting member thermally connecting a predetermined portion of the wiring pattern and the heat conducting pattern to a predetermined heat conduction region of the case member, the predetermined heat conduction region being a surface of the case member opposing to the wiring substrate and being located further from the wiring substrate than a surface of the body portion opposing to the case member.