SEMICONDUCTOR DEVICE PRODUCTION METHOD

摘要

A semiconductor device production method that includes: a step A for preparing a laminate body wherein a semiconductor chip is fixed upon a support body; a step B for arranging a sealing sheet and a protective film on the semiconductor chip of the laminate body; a step C for embedding the semiconductor chip in the sealing sheet and forming a sealed body wherein the semiconductor chip is embedded in the sealing sheet; a step D for thermosetting the sealing sheet of the sealed body; and a step E for peeling off the protective film after the previous step D.