MULTILAYER WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board manufacturing method which allows a wiring width of the multilayer wiring board to be formed at a narrow pitch and allows solder bumps on the multilayer wiring board to be formed at a narrow pitch.SOLUTION: A multilayer wiring board manufacturing method comprises: a seed layer formation process of forming seed layers on a surface and a rear face of an insulating substrate in an interlayer connection state; a wiring plating resist formation process of forming a wiring plating resist on a surface of each seed layer; an electrolytic copper plating process of performing electrolyte copper plating to form a wiring layer on each seed layer; an electrode plating resist formation process of forming an electrode plating resist on the wiring layer and the wiring plating resist except an electrode formation scheduled part; a solder plating process of forming a solder plating layer on the electrode formation scheduled part; a plating resist removal process of removing the wiring plating resist and the electrode plating resist; an etching process of removing the seed layer exposed after the plating resist removal process; and a solder resist formation process of forming a solder resist layer with a formation portion of the solder plating layer being left.SELECTED DRAWING: Figure 2