| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a double layer structure wafer, by which misalignment of the center of a wafer can be avoided.SOLUTION: A method for processing a double layer structure wafer comprises: a holding step for holding the side of a second wafer (31) of a double layer structure wafer (11) on a chuck table (4); an outline-deducing step for deducing the outline of the second wafer by taking an image of an exposed region of the surface (31a) of the second wafer from the side of a first wafer (21), and detecting three or more points of coordinates on the peripheral edge (31c) of the second wafer; a chamfering part-removing step for positioning a cutting blade (10) on the peripheral edge of the second wafer, and causing the cutting blade to cut into the peripheral edge (21c) of the first wafer while rotating the chuck table, thereby annularly cutting the peripheral edge of the first wafer along the peripheral edge of the second wafer and thus, removing a chamfering part of the first wafer to make the center of the first wafer coincident with the center of the second wafer; and a grinding step for grinding the first wafer for decrease in thickness.SELECTED DRAWING: Figure 2 |
