| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can achieve thinning of a wiring part.SOLUTION: A manufacturing method of a wiring board 1 comprises: a first process of filling a recess 61 of an engraved plate 6 with a first resin material 62 and causing cure shrinkage of the first resin material 62 to form a first cured resin 621 having a depressed part 63 which is depressed toward a bottom of the recess 61; a second process of filling the depressed part 63 with a conductive material 64; and a third process of demolding the first cured resin 621 and the conductive material 64 from the engraved plate 6.SELECTED DRAWING: Figure 2 |
