发明名称 Inkjet Head
摘要 Inkjet head comprising a substrate having pressure chambers, which contain ink, communicate with respective nozzles from which the ink is ejected in a predetermined direction. A spacer substrate is disposed on an opposite side of a diaphragm from the predetermined direction. The diaphragm forms one surface of each of the pressure chambers, which is on an opposite side of the each of the pressure chambers from the predetermined direction. A wiring substrate is disposed on an opposite side of the spacer substrate from the predetermined direction. Actuators are in contact with the diaphragm in a space formed by the spacer substrate between the wiring substrate and the diaphragm, the actuators being electrically connected to respective wires of the wiring substrate. Differences in coefficients of thermal expansion between the pressure-chamber substrate, the diaphragm, the spacer substrate, and the wiring substrate are equal to or less than a predetermined value.
申请公布号 US2016144625(A1) 申请公布日期 2016.05.26
申请号 US201414891571 申请日期 2014.05.12
申请人 KONICA MINOLTA, INC. 发明人 MACHIDA Yuichi
分类号 B41J2/14 主分类号 B41J2/14
代理机构 代理人
主权项 1. An inkjet head comprising: a pressure-chamber substrate in which pressure chambers to contain ink are formed, the pressure chambers communicating with respective nozzles from which the ink is ejected in a predetermined direction; a spacer substrate disposed on an opposite side of a diaphragm from the predetermined direction, wherein the diaphragm forms one surface of each of the pressure chambers, and the one surface is on an opposite side of the each of the pressure chambers from the predetermined direction; a wiring substrate disposed on an opposite side of the spacer substrate from the predetermined direction; and actuators in contact with the diaphragm in a space formed by the spacer substrate between the wiring substrate and the diaphragm, the actuators being electrically connected to respective wires of the wiring substrate, wherein differences in coefficients of thermal expansion between the pressure-chamber substrate, the diaphragm, the spacer substrate, and the wiring substrate are equal to or less than a predetermined value.
地址 Tokyo JP