ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to an element embedded printed circuit board and a method of manufacturing the same. More particularly, according to an embodiment of the present invention, the element embedded printed circuit board includes a substrate including a first circuit layer formed on one surface of an insulating layer and a second circuit layer formed on the other surface of the insulation layer, and an element having an electrode portion and embedded in the insulating layer of the substrate. The electrode portion of the element is in contact with the first circuit layer. Thus, an unnecessary circuit layer can be removed, thereby reducing the thickness of the element embedded printed circuit board.