| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can enhance an appearance of a semiconductor device to be manufactured.SOLUTION: A semiconductor device manufacturing method comprises: a process A of preparing a laminate in which a semiconductor chip is fixed on to a support medium; a process B of arranging an encapsulation sheet and a protective film on the semiconductor chip of the laminate; a process C of embedding the semiconductor chip in the encapsulation sheet to form an encapsulated body with the semiconductor chip being embedded in the encapsulation sheet; a process D of thermally curing the encapsulation sheet of the encapsulated body; and a process E of peeling the protective film after the process D.SELECTED DRAWING: Figure 6 |
