发明名称 Pb-FREE Mg-Cu-BASED SOLDER ALLOY
摘要 PROBLEM TO BE SOLVED: To provide Pb-free solder alloy for high temperature, which has a solidus temperature of about 500°C or lower, is excellent in bondability, workability and reliability, and is substantially inexpensive in comparison with Au-based solder.SOLUTION: In a Pb-free Mg-Cu-based solder alloy containing one or more kinds among Ag, In, Sn and Zn, one or more kinds of Ge and Sb, AL, Ni or P, as accessory components, in addition to Mg and Cu as main components, the content of Cu is 20.0 mass% or more and 48.0 mass% or less.SELECTED DRAWING: None
申请公布号 JP2016093831(A) 申请公布日期 2016.05.26
申请号 JP20140232260 申请日期 2014.11.15
申请人 SUMITOMO METAL MINING CO LTD 发明人 IZEKI TAKASHI;KOMURO MASAHIKO;BONG SHUNKAI
分类号 B23K35/28;C22C23/00;H01L21/52;H05K3/34 主分类号 B23K35/28
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