METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY BASED ON PRINTED ELECTRONICS AND PRINTED CIRCUIT BOARD ASSEMBLY

摘要

A printed circuit board assembly (1) and a method for manufacturing a printed circuit board assembly (1) are provided. The method comprises: providing a substrate (2), printing a circuit pattern on the substrate (2) thereby forming a bottom layer (4a) of an uncured conductive material (7) and a top layer (4b) of an insulating material (8), arranging at least one electronic component (5), having at least one electrical connection part (6), on the top layer (4b) of the circuit pattern, the at least one electrical connection part (6) of the at least one electronic component (5) forming at least one electrical connection (9) with the bottom layer (4a) comprising the uncured conductive material (7), and, after arranging said at least one electronic component (5) on the top layer (4b), curing the conductive material (7) and the insulating material (8). By this method, the conductive material (7) mechanically secures said at least one electronic component (5) to the substrate (2).

主权项

1. A method for manufacturing a printed circuit board assembly, comprising:
providing a substrate, printing a circuit pattern on the substrate thereby forming a bottom layer of an uncured conductive material covered by a top layer of an insulating material, arranging at least one electronic component, having at least one electrical connection part, on the top layer of the circuit pattern, the at least one electrical connection part of the at least one electronic component penetrating the top layer of the insulating material and forming at least one electrical connection with the bottom layer comprising the uncured conductive material, and, after arranging said at least one electronic component on the top layer, curing the conductive material and the insulating material, whereby the conductive material mechanically secures said at least one electronic component to the substrate.