发明名称 LED ELEMENT AND METHOD OF MANUFACTURING THE SAME
摘要 An LED element capable of further improving the light extraction efficiency and its manufacturing method are provided.;An LED element comprises a semiconductor lamination part that includes a light-emitting layer, a diffractive surface on which light emitted from the light-emitting layer is incident and on which projection parts are formed with a period larger than an optical wavelength of the light and smaller than a coherence length of the light and which reflects the incident light in a plurality of modes according to a Bragg diffraction condition and transmits the incident light in a plurality of modes according to the Bragg diffraction condition, and a reflecting surface that reflects light refracted by the diffractive surface so that the reflected light is incident on the diffractive surface again, wherein the semiconductor lamination part is formed on the diffractive surface without any void around the projection parts and a proportion of a flat part in the diffractive surface is 40% or more in a plan view thereof.
申请公布号 US2016149076(A1) 申请公布日期 2016.05.26
申请号 US201414784936 申请日期 2014.04.15
申请人 EL-SEED CORPORATION 发明人 KITANO Tsukasa;MORI Midori;KONDO Toshiyuki;SUZUKI Atsushi;NANIWAE Koichi;OHYA Masaki
分类号 H01L33/10;H01L33/00;H01L33/26;H01L33/20;H01L33/40 主分类号 H01L33/10
代理机构 代理人
主权项 1. An LED element comprising: a semiconductor lamination part that includes a light-emitting layer; a diffractive surface on which light emitted from the light-emitting layer is incident and on which projection parts are formed with a period larger than an optical wavelength of the light and smaller than a coherence length of the light and which reflects the incident light in a plurality of modes according to a Bragg diffraction condition and transmits the incident light in a plurality of modes according to the Bragg diffraction condition; and a reflecting surface that reflects light refracted by the diffractive surface so that the reflected light is incident on the diffractive surface again, wherein the semiconductor lamination part is formed on the diffractive surface without any void around the projection parts, and a proportion of a flat part in the diffractive surface is 40% or more in a plan view thereof.
地址 Nagoya-shi, Aichi JP
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