FILM CUTTING APPARATUS AND FILM CUTTING AND ATTACHING SYSTEM HAVING THE SAME

摘要

The present invention relates to a film cutting device. The device includes: a first cutting unit which divides a whole film sheet into film sheets which have a predetermined length by cutting the whole film sheet in the latitudinal direction; and a second cutting unit which divides the film sheet into unit films which have a predetermined length and a predetermined width by cutting the film sheet in the longitudinal direction which is perpendicular to the latitudinal direction. The second cutting unit includes: a laser oscillator which generates and oscillates laser beams; a path converter which converts the path of the laser beams oscillated by the laser oscillator to one among a first path and a second path; a first cutting head which receives the laser beams the path of which has been converted to the first path and radiates the laser beams in the longitudinal direction onto the film sheet; and a second cutting head which receives the laser beams the path of which has been converted to the second path and radiates the laser beams in the longitudinal direction onto the film sheet. The film cutting device is capable of dividing the whole film sheet into the unit films which have the predetermined unit length and the predetermined unit width by cutting the whole film sheet by means of the laser beams. Therefore, because it is possible to divide the whole film sheet into the unit films by using the film cutting device only without any need for preparing a slitting device and the cutting device independently from each other, it is possible to reduce installation costs and installation space necessary for preparing the devices necessary for a whole film sheet cutting process and shorten the process time spent for the whole film sheet cutting process.