WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the reliability of a pad in a wiring board on which electronic components are mounted in pads in an opening on an insulation layer.SOLUTION: An electronic component comprises: a first wiring layer 21; an insulation layer 31 formed on the first wiring layer 21; an electronic components mounting pad P formed on the insulation layer 31 in a region overlapping the first wiring layer 21 in a plan view and having a plurality of projections Px apart from the first wiring layer 21 on the under surface.SELECTED DRAWING: Figure 16