| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device which properly performs soldering even when a component is held by a movable arm, and to provide a component soldering method using the soldering device.SOLUTION: A soldering device 1 solders a component PA held by a movable arm 10 to a circuit board CS and includes: a heater 40 on which the circuit board CS is disposed; and spray ports 43 provided in portions of the heater 40, which exclude a predetermined arrangement portion in which the circuit board CS should be disposed, the spray ports 43 being configured to spray a reducing gas.SELECTED DRAWING: Figure 1 |
