发明名称 THERMODYNAMIC RAM TECHNOLOGY STACK
摘要 A thermodynamic RAM technology stack, two or more memristors or pairs of memristors comprising AHaH (Anti-Hebbian and Hebbian) computing components, and one or more AHaH nodes composed of such memristor pairs that form at least a portion of the thermodynamic RAM technology stack. The levels of the thermodynamic-RAM technology stack include the memristor, a Knowm synapse, an AHaH node, a kT-RAM, kT-RAM instruction set, a sparse spike encoding, a kT-RAM emulator, and a SENSE Server.
申请公布号 US2016148091(A1) 申请公布日期 2016.05.26
申请号 US201514722626 申请日期 2015.05.27
申请人 KnowmTech, LLC 发明人 Nugent Alex;Molter Timothy
分类号 G06N3/063;G06N3/08 主分类号 G06N3/063
代理机构 代理人
主权项 1. Thermodynamic RAM, comprising: an AHaH circuit with a RAM interface.
地址 Albuquerque NM US