发明名称 |
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED WIRING BOARD PREPARED THEREWITH |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having excellent low water absorption and low thermal expansion properties, and a prepreg, laminate, and printed wiring board prepared therewith.SOLUTION: A thermosetting resin composition comprises (a) maleimide compound having at least two N-substituted maleimide groups in one molecule, (b) silicone compound having an acidic substituent in a molecular structure, and (c) thermosetting resin.SELECTED DRAWING: None |
申请公布号 |
JP2016094611(A) |
申请公布日期 |
2016.05.26 |
申请号 |
JP20150229621 |
申请日期 |
2015.11.25 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
KOTAKE TOMOHIKO;MIYATAKE MASATO;NAGAI SHUNSUKE;HASHIMOTO SHINTARO;INOUE YASUO;TAKANEZAWA SHIN;MURAI HIKARI |
分类号 |
C08L101/02;B32B5/28;B32B27/04;B32B27/38;C08G65/34;C08G73/12;C08J5/24;C08L79/04;C08L83/06;H05K1/03 |
主分类号 |
C08L101/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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