发明名称 SOLDER CORRECTION DEVICE AND SOLDER CORRECTION METHOD
摘要 PROBLEM TO BE SOLVED: To correct a defective solder point using trace soldering equipment.SOLUTION: A solder correction device includes: appearance inspection equipment which inspects a solder defect on a work having a mounted component, to store information of the defective solder point; and trace soldering equipment which selectively jet flows molten solder upon the defective solder point, while relatively moving one of the work and a jet nozzle for jet flowing the molten solder.SELECTED DRAWING: Figure 1
申请公布号 JP2016096173(A) 申请公布日期 2016.05.26
申请号 JP20140229498 申请日期 2014.11.12
申请人 TAMURA SEISAKUSHO CO LTD 发明人 SHIDA ATSUSHI;YAMAMORI SHINICHI;SEKINE SHUICHI;SHIMANUKI KOHEI
分类号 H05K3/34 主分类号 H05K3/34
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